Aimechatec Secures Major Order for Wafer-Level Packaging System

TOKYO, Aug 07 (Pulse News Wire) – Aimechatec,ltd. (6227.T), led by President and CEO Abi Inazo, announced a significant order from a major overseas semiconductor manufacturer for wafer-level packaging systems.

The system, which includes temporary bonding and debonding equipment, is valued at approximately ¥5 billion. This advanced technology supports the thinning and stacking processes crucial for next-generation semiconductors driven by AI, 5G, IoT, and autonomous driving markets. AI Mechatec's expertise in wafer handling and cleaning technologies has earned high praise, leading to this substantial contract.

Sales recognition for this order is expected during the fiscal year ending June 2028. The company noted that while the order is entirely in yen, there will be no impact from foreign exchange rate fluctuations. Any adjustments to the current fiscal year’s performance forecast due to scheduling changes with the customer will be disclosed promptly.