Aimechatec Wins Major Order for Advanced Semiconductor Packaging Systems

TOKYO, Jul 22 (Pulse News Wire) – Aimechatec,ltd. (6227.T) announced that it has received multiple orders for solder ball mounting systems from leading overseas semiconductor manufacturers for advanced AI semiconductor packaging applications.

The orders, valued at approximately ¥2.500 billion, are expected to contribute to sales in the fiscal year ending June 2028. The company's innovative solder ball mounting system integrates advanced integration technologies developed through extensive experience in production equipment, offering high stability and productivity. This solution was highly regarded by customers seeking robust manufacturing capabilities for data center-focused AI semiconductors, driving the need for increased production capacity among major semiconductor firms.

Regarding the impact on performance, AI Mechatec expects to recognize the revenue from these orders in the fiscal year ending June 2028. However, should adjustments due to customer delivery schedules affect the forecast for the fiscal year ending June 2027, which is scheduled for public release on August 07, 2026, the company will promptly disclose any necessary revisions. All transactions are denominated in yen, mitigating potential exchange rate fluctuations.