TOKYO, Mar 13 (Pulse News Wire) – Tokyo Electron Device Limited (276A.T) announced today that its board of directors, held, approved a loan agreement with special financial covenants. The loan is part of the funding for the acquisition of real estate properties previously disclosed on February 16, 2026.
Key details of the loan include: - Borrowing institution: Chukyo Bank Co., Ltd. - Amount borrowed: ¥960 million - Execution date: March 25, 2026 - Interest rate: Variable interest based on benchmark rates plus spread - Repayment date: March 25, 2028 - Repayment method: Lump sum payment due on the repayment date - Collateral: Provided Additionally, the loan agreement includes financial covenants requiring: - Maintenance of net assets at least equal to 75% times the amount reported in the fiscal year ended August 2025, effective from the fiscal year ending August 2026 onwards.
- Avoidance of consecutive losses in ordinary profit for two consecutive fiscal periods starting from the fiscal year ending August 2026. The impact of this loan agreement has been incorporated into the company's consolidated performance forecast for the fiscal year ending August 2026.
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