TOKYO, Jun 29 (Pulse News Wire) – JTEC Corporation (3446.T) announced today that it has secured orders for its next-generation surface processing and grinding devices, Plasma Chemical Vapor Metallurgy (Plasma CVM) and Plasma Assisted Polishing (PAP). The orders, valued at approximately ¥530 million, were placed by crystal oscillator manufacturers and Diamond Wafer Kanren Kigyou.
Delivery schedules are set for June 2026 for PAP and July 2026 onwards for Plasma CVM. Details of the orders remain confidential due to commercial sensitivity. Looking ahead, JTEC plans to advance its Innovation2030 strategy by enhancing and expanding practical applications of semiconductor materials' surface processing technology.
The June 2026 delivery of PAP is included in the current fiscal forecast, while the impact of future Plasma CVM deliveries will be assessed later. Any significant developments will be disclosed promptly. JTEC's Plasma CVM enables ultra-precise thinning of crystal wafers down to nanometer levels, addressing growing demand for high-performance data centers and communication networks.
Meanwhile, the PAP device achieves sub-nanometer smoothness without mechanical damage, meeting diverse needs in emerging diamond semiconductor markets.
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