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Loan Notice6597HPC SYSTEMS Inc. · TSE Growth

HPC Systems to Borrow Funds Under Special Overdraft Agreement

TOKYO, Jul 02 (Pulse News Wire) – HPC Systems Inc. (6597.T) announced today that it has decided to borrow funds based on a special overdraft agreement disclosed on April 02, 2026. The purpose of the b

– HPC Systems Inc. (6597.T) announced today that it has decided to borrow funds based on a special overdraft agreement disclosed on April 02, 2026.

The purpose of the borrowing is to partially fund the procurement of materials related to a major order announced on April 01, 2026. The key details of the agreement are as follows: - Contract Counterparty: Mizuho Bank Co., Ltd.

- Maximum Loan Amount: ¥12.00 billion - Interest Rate: Benchmark rate plus spread - Contract Signing Date: April 02, 2026 - Term: Two years and four months - Collateral/Guarantee: Unsecured and unguaranteed - Current Borrowing Amount: ¥587 million - Outstanding Balance After This Drawdown: ¥6.427 billion - Execution Date of This Drawdown: July 02, 2026 Looking ahead, HPC Systems stated that it will provide updates on the balance changes resulting from this loan execution on an ongoing basis.

PDFOriginal disclosureTDnet filing · Japanese · 17:00 JSTView original ↗
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