Es-Con Japan Issues Third Unsecured Bond for Project Expansion

TOKYO, Jul 10 (Pulse News Wire) – ES-CON JAPAN Ltd. (8892.T) announced the issuance of its third unsecured bond.

The total issue amount is expected to be ¥15.00 billion, with each bond valued at ¥100 million. The bonds carry an annual interest rate of 2.796%, payable semi-annually on January 16 and July 16. The repayment amount per bond is ¥100 million, due on July 16, 2031. Funds raised from this issuance will support operational needs associated with expanding domestic and international development projects.

Mizuho Securities Co., SMBC Nikko Securities Co., and Daiwa Securities Co. serve as lead underwriters, while Mizuho Bank acts as the bond management assistant. The settlement date for the bond is set for July 16, 2026. This announcement is intended solely for public disclosure and does not constitute investment advice or similar activities.