Source disclosure: February 16, 2026
Chi-technology Co.,Ltd. [5581.T]
TOKYO, Feb 16 (Pulse News Wire) -- Chi-technology Co., Ltd. (5581.T), represented by President Harumi Hara, announced today that its board of directors, held on February 16, 2026, approved the signing of a commitment line agreement and the borrowing of funds. The company aims to establish a stable financial foundation and secure more flexible funding methods through this agreement.
The commitment line agreement is set to be signed with Resona Bank Corporation on February 25, 2026, with a credit limit of ¥200 million. The contract will run until February 24, 2027, and carries a floating interest rate based on the benchmark rate plus spread. Additionally, the agreement includes certain financial covenants requiring the company to maintain its standalone balance sheet equity ratio at 75% or higher compared to the previous year-end and avoid consecutive operating losses over two fiscal periods post-contract execution.
Chi-technology also plans to borrow funds from Mizuho Bank, Kansai Sumitomo Mitsui Banking Corporation, and Sumitomo Mitsui Banking Corporation. Each bank will provide ¥100 million, totaling ¥300 million. These loans will carry fixed or variable interest rates depending on the lender and are scheduled to be disbursed on February 27, 2026. Loan durations vary, with two banks offering five-year terms and one providing a one-year term. All three loans are unsecured.
Regarding future outlook, the company anticipates minimal impact on its performance for the August 2026 fiscal period due to these transactions but has committed to promptly disclosing any significant developments as they arise.
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